Edexcel GCSE Design and Technology · 1DT0
Specification 5.3.4, 5.5.1, 5.6.3 · Paper 1
An assembly method in which electronic components are soldered directly onto pads on the surface of a printed circuit board.
Revise: Cost FactorsWith surface-mount technology (SMT), components are soldered directly onto surface pads. In automated assembly, solder paste is printed onto the pads, a pick-and-place machine positions the components, and a reflow oven melts the solder to make the joints. Inspection and testing then check assembly quality and electrical connections.
- Revise: Component Stock Forms and Types